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Strain bridges
The device integrates switches capable of delivering an output current up to 1 A
Intelligent power saving
4 Gbps High-Performance Memory Bandwidth and Shared Memory Based Switch Fabric with Fully Non-Blocking Configuration • Dual MII/RMII with MAC 3 SW3-MII/RMII and MAC 4 SW4-MII/RMII Interfaces • Enable/Disable Option for Huge Frame Size up to 2000 Bytes Per Frame • IGMP v1/v2 Snooping (IPv4) Support for Multicast Packet Filtering • IPv4/IPv6 QoS Support • Support Unknown Unicast/Multicast Address and Unknown VID Packet Filtering • Self-Address Filtering
Intel Central Processing Unit part #: CM8068404311404S RGE3 | CPU | DEX FPGA - Configuration Memory Strain bridgesIntel Central Processing Unit part #: CM8068404311404S RGE3 System Memory Interface: Two channels of LPDDR3 and DDR4 memory with a maximum of two DIMMs per channel. DDR technologies, number of DIMMs per channel, number of ranks per channel are SKU dependent. UDIMM, SO DIMM, and Memory Down support (based on SKU) Single channel and dual channel memory organization modes Data burst length of eight for all memory organization modes LPDDR3 I O voltage of
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